Modeling of acid copper electroplating: A review

Journal of Electronics Manufacturing

Volumn 8, Issue 1, 1998, Pages 15-37

  Poon, Gary K K ^a   Williams, D J ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CURRENT DENSITY; ELECTRIC CURRENT DISTRIBUTION; MATHEMATICAL MODELS;

ACID COPPER ELECTROPLATING;

ELECTROPLATING;

EID: 0032010224     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313198000033     Document Type: Article

References (16)

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