Optimal parameter selection for electronic packaging using sequential computer simulations

Journal of Manufacturing Science and Engineering

Volumn 128, Issue 3, 2006, Pages 705-715

  Gupta, Abhishek ^a   Ding, Yu ^b   Xu, Leon ^c   Reinikainen, Tommi ^c  

^a UNIVERSITY OF PENNSYLVANIA   (United States)

^b Department of Electrical and Computer Engineering   (United States)

^c NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL COMPLEXITY; COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; STATISTICAL METHODS; SYSTEMS ANALYSIS;

DESIGN OF EXPERIMENT (DOE); OPTIMAL PARAMETER; RESPONSE SURFACE METHODOLOGY (RSM);

ELECTRONICS PACKAGING;

EID: 33746924549     PISSN: 10871357     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2193551     Document Type: Article

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