High density interconnect embedded magnetics for integrated power

IEEE Transactions on Power Electronics

Volumn 21, Issue 4, 2006, Pages 867-879

  Roshen, Waseem A ^a   Korman, Charlie S ^b   Daum, Wolfgang ^b  

^a SSPower Technology   (United States)

^b GE GLOBAL RESEARCH   (United States)

Author keywords

High density interconnect (HDI); Multichip modules (MCM)

Indexed keywords

DIELECTRIC DEVICES; ELECTROPLATING; MICROPROCESSOR CHIPS; OPTICAL INTERCONNECTS; POWER INDUCTORS; TRANSFORMER MAGNETIC CIRCUITS;

HIGH DENSITY INTERCONNECT (HDI); LAMINATING DIELECTRIC LAYERS; MONOLITHIC STRUCTURE;

MULTICHIP MODULES;

EID: 33746887353     PISSN: 08858993     EISSN: None     Source Type: Journal    
DOI: 10.1109/TPEL.2006.876893     Document Type: Article

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