Nanohole volume dependence on the cure schedule in epoxy thermosetting networks: A PALS study

Polymer

Volumn 47, Issue 14, 2006, Pages 5066-5070

  Salgueiro, W ^a   Ramos, J ^b   Somoza, A ^a,c   Goyanes, S ^d,e   Mondragon I ^b  

^a UNIVERSIDAD NACIONAL DEL CENTRO DE LA PROVINCIA DE BUENOS AIRES   (Argentina)

^b Escuela Universitaria Politecnica   (Spain)

^c Centro Científico y Tecnológico Consejo Nacional de Investigaciones Científicas y Técnicas   (Argentina)

^d UNIVERSIDAD DE BUENOS AIRES   (Argentina)

^e Facultad de Ciencias Naturales e Instituto M Lillo   (Argentina)

Author keywords

Cure schedule; Epoxy; Hardener

Indexed keywords

CROSSLINKING; EPOXY RESINS; GLASS TRANSITION; POSITRONS; THERMAL EFFECTS;

CURE SCHEDULE; EPOXY; EPOXY SYSTEMS; HARDENER;

THERMOSETS;

CROSS LINKING; CURING; GLASS TRANSITION TEMPERATURE; TEMPERATURE EFFECT; THERMOSETTING POLYMER; THERMOSETTING PROPERTY;

EID: 33746847251     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2006.05.032     Document Type: Article

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