메뉴 건너뛰기




Volumn 2, Issue , 2005, Pages 638-643

Design, modeling and characterization of embedded capacitor networks for mid-frequency decoupling in semiconductor systems

Author keywords

Characterization midband frequency; Decoupling; Embedded capacitors; Modeling

Indexed keywords

CONSUMER ELECTRONICS; COUPLED CIRCUITS; EMBEDDED SYSTEMS; NATURAL FREQUENCIES; NETWORKS (CIRCUITS); SEMICONDUCTOR DEVICES;

EID: 33746659893     PISSN: 10774076     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISEMC.2005.1513592     Document Type: Conference Paper
Times cited : (13)

References (6)
  • 1
    • 1642402127 scopus 로고    scopus 로고
    • Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in Multilayer Packages and PCB's
    • February
    • Hyungsoo Kim, Byung Kook Sun, and Joungho Kim, "Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in Multilayer Packages and PCB's," IEEE Microwave and Wireless Components Letters, Vol 14, NO 2, February 2004
    • (2004) IEEE Microwave and Wireless Components Letters , vol.14 , Issue.2
    • Kim, H.1    Sun, B.K.2    Kim, J.3
  • 2
    • 4544280672 scopus 로고    scopus 로고
    • "Embedded resistors and capacitors for organic-based SOP
    • May
    • Richard Ulrich,"Embedded Resistors and Capacitors for Organic-Based SOP," IEEE Transactions on Advanced Packaging,Vol 27, NO. 2, May 2004
    • (2004) IEEE Transactions on Advanced Packaging , vol.27 , Issue.2
    • Ulrich, R.1
  • 3
    • 33746625820 scopus 로고    scopus 로고
    • Packaging of multi-core processors: Tradeoffs and potential solutions
    • in press
    • Prathap Muthana, Madhavan Swaminathan, "Packaging of Multi-core processors: Tradeoffs and Potential Solutions," ECTC 2005., in press.
    • ECTC 2005
    • Muthana, P.1    Swaminathan, M.2
  • 5
    • 0036589412 scopus 로고    scopus 로고
    • Modeling of multilyaer power distribution planes using transmission matrix method
    • May
    • Joong-Ho Kim and Madhavan Swaminathan," Modeling of Multilyaer Power Distribution Planes using Transmission Matrix Method," IEEE Transactions on Advanced Packaging, Vol 25, NO. 2, May 2005
    • (2005) IEEE Transactions on Advanced Packaging , vol.25 , Issue.2
    • Kim, J.-H.1    Swaminathan, M.2
  • 6
    • 0032287456 scopus 로고    scopus 로고
    • ESR and ESL of ceramic capacitor applied to decoupling applications
    • October
    • Tanmoy Roy, Larry Smith, "ESR and ESL of Ceramic capacitor applied to Decoupling Applications," Electrical Performance of Electronic Packaging, October 1998
    • (1998) Electrical Performance of Electronic Packaging
    • Roy, T.1    Smith, L.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.