Thermal analysis study of viscoelastic properties and activation energy of melamine-modified urea-formaldehyde resins

Journal of Adhesion Science and Technology

Volumn 20, Issue 8, 2006, Pages 803-816

  Kim, Sumin ^a   Kim, Hyun Joong ^a   Kim, Hee Soo ^a   Lee, Young Kyu ^a   Yang, Han Seung ^b  

^a Seoul National University   (South Korea)

^b WASHINGTON STATE UNIVERSITY   (United States)

Author keywords

Activation energy; DMTA; DSC; Formaldehyde emission; Melamine formaldehyde resin; Urea formaldehyde resin; Viscoelastic properties

Indexed keywords

ACTIVATION ENERGY; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC MECHANICAL ANALYSIS; THERMOANALYSIS; UREA FORMALDEHYDE RESINS; VISCOELASTICITY; CURING; ELASTIC MODULI; FORMALDEHYDE; SYNTHETIC RESINS; UREA;

DYNAMIC MECHANICAL THERMAL ANALYSIS (DMTA); FORMALDEHYDE EMISSION; KISSINGER EQUATION; STORAGE MODULUS;

MELAMINE FORMALDEHYDE RESINS;

CURING REACTIONS; DIFFERENT SUBSTRATES; DMTA; DSC; DSC SCANS; DYNAMIC MECHANICAL THERMAL ANALYSIS; EXOTHERMS; FORMALDEHYDE EMISSION; KISSINGER EQUATION; LOSS FACTOR; LOSS MODULI; MELAMINE-FORMALDEHYDE; RESIN CONTENT; RESIN MIXTURES; RESIN SYSTEMS; UREA FORMALDEHYDE; VISCOELASTIC PROPERTIES;

EID: 33746497256     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856106777638671     Document Type: Article

References (22)

1. G. Coullerez, D. Leonard, S. Landmark and H. J. Mathieu, Surf. Interface Anal. 29, 431-443 (2000).
2. M. Rishole-Sundman and N. Wallin, Holz Roh Werkstoff 57, 319-324 (1999).
3. R. Otson and P. Fellin, in: Gaseous Pollutants, J. O. Nriagu (Ed.), pp. 335-421. Wiley, New York, NY (1992).
4. T. J. Kelly, D. L. Smith and J. Satola, Environ. Sci. Technol. 33, 81-88 (1999).
5. J. A. Pickrell, L. C. Griffis, B. V. Mokler, C. H. Hobbs, G. M. Kanapilly and A. Bathija, in: Formaldehyde Release from Wood Products, B. Meyer, B. Andrews and R. M. Reinhardt (Eds), pp. 40-51. American Chemical Society, Washington, DC (1986).
6. S. Kim, Y.-K. Lee, H.-J. Kim and H. H. Lee, J. Adhesion Sci. Technol. 17, 1863-1875 (2003).
7. S. Kim and H.-J. Kim, Holz Roh Werkstoff 62, 101-106 (2004).
8. S. Kim and H.-J. Kim, Indoor Air 15, 317-325 (2005).
9. S. Kim and H.-J. Kim, Bioresource Technol. 96, 1457-1464 (2005).
10. S. Kim and H.-J. Kim, Int. J. Adhesion Adhesives 25, 456-461 (2005).
11. A. H. Conner, in: Polymeric Materials Encyclopedia, J. C. Salamone (Ed.), pp. 8496-8501. CRC Press, Boca Raton, FL (1996).
12. S. Jahromi, Polymer 40, 5103-5109 (1999).
13. Y. P. Khanna and T. J. Taylor, Polym. Eng. Sci. 27, 764-768 (1987).
14. J. Dupuy, E. Leroy and A. Maazouz, J. Appl. Polym. Sci. 78, 2262-2271 (2000).
15. Y.-K. Lee, D.-J. Kim, H.-J. Kim, T.-S. Hwang, M. Rafailovich and J. Sokolov, J. Appl. Polym. Sci. 89, 2589-2596 (2003).
16. R. Wetton, R. Marsh and J. V. Velde, Thermochim. Acta 175, 1-11 (1991).
17. S. Kim and H.-J. Kim, J. Adhesion Sci. Technol. 17, 1369-1383 (2003).
18. A. Kumar and A. Sood, J. Appl. Polym. Sci. 40, 1473-1486 (1990).
19. H. E. Kissinger, Anal. Chem. 29, 1702-1706 (1957).
20. M. Szesztay, Z. László-Hedvig, E. Kovacsovic and F. Tüdos, Holz Roh Werkstoff 51, 297-300 (1993).
21. A. Pizzi (Ed.), Wood Adhesives. Marcel Dekker, New York, NY (1983).
22. A. Pizzi and L. A. Panamgama, J. Appl. Polym. Sci. 58, 109-115 (1995).