Physico-mechanical properties of particleboards bonded with pine and wattle tannin-based adhesives

Journal of Adhesion Science and Technology

Volumn 17, Issue 14, 2003, Pages 1863-1875

  Kim, Sumin ^a   Lee, Young Kyu ^a   Kim, Hyun Joong ^a   Lee, Hwa Hyoung ^b  

^a Seoul National University   (South Korea)

^b Chungnam National University   (South Korea)

Author keywords

Hardener; Mechanical properties; Phloroglucinolic A rings; Physical properties; Pine tannin; Wattle tannin

Indexed keywords

BOND STRENGTH (MATERIALS); ENVIRONMENTAL IMPACT; EXPANSION; HEALTH CARE; PHENOLS; STRUCTURE (COMPOSITION); SWELLING; THERMAL EFFECTS; THERMOSETS; VOLATILE ORGANIC COMPOUNDS; WATER ABSORPTION; WOOD PRODUCTS; ACETAL RESINS; ADHESIVES; MECHANICAL PROPERTIES; PHYSICAL PROPERTIES;

AIR EXCHANGE RATES; NUCLEOPHILICITY; PARTICLEBOARDS;

ADHESIVES; PARTICLE BOARD;

A-RINGS; HARDENER; PHLOROGLUCINOLIC; PINE TANNINS; WATTLE TANNIN;

EID: 0347592439     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103770572025     Document Type: Article

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