Residual stress and its effect on yielding in SiC/Ti plate

JSME International Journal, Series A: Solid Mechanics and Material Engineering

Volumn 49, Issue 1, 2006, Pages 25-31

  Zhou, Fenghua ^a   Hashimoto, Ryosaku ^b   Ogawa, Akinori ^b   Sofue, Yasushi ^b  

^a Johns Hopkins University   (United States)

^b JAPAN AEROSPACE EXPLORATION AGENCY   (Japan)

Author keywords

Micromechanical model; SiC Ti composite; Tensile property; Thermal residual stress

Indexed keywords

COMPUTER SIMULATION; FIBER REINFORCED METALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; METALLIC MATRIX COMPOSITES; RESIDUAL STRESSES; SILICON CARBIDE; TENSILE PROPERTIES; THERMAL STRESS; TITANIUM; YIELD STRESS;

MICROMECHANICAL MODEL; THERMAL RESIDUAL STRESS;

PLATES (STRUCTURAL COMPONENTS);

COMPUTER SIMULATION; FIBER REINFORCED METALS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; METALLIC MATRIX COMPOSITES; PLATES (STRUCTURAL COMPONENTS); RESIDUAL STRESSES; SILICON CARBIDE; TENSILE PROPERTIES; THERMAL STRESS; TITANIUM; YIELD STRESS;

EID: 33746381231     PISSN: 13447912     EISSN: 13475363     Source Type: Journal    
DOI: 10.1299/jsmea.49.25     Document Type: Article

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