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Volumn 21, Issue 6, 2006, Pages 1434-1442

High-temperature tolerance of the silver-copper oxide braze in reducing and oxidizing atmospheres

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; COPPER OXIDES; DEBONDING; HIGH TEMPERATURE APPLICATIONS; HYDROGEN; OXIDATION; SCANNING ELECTRON MICROSCOPY; SILVER COMPOUNDS;

EID: 33746143606     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2006.0178     Document Type: Article
Times cited : (20)

References (21)
  • 1
    • 0008024416 scopus 로고    scopus 로고
    • Degradation effects at sealing glasses for the SOFC
    • edited by A.J. McEvoy (European Fuel Cell Forum, Oberrohrdorf, Switzerland)
    • K. Eichler, G. Solow, P. Otschik, and W. Schaffrath: Degradation effects at sealing glasses for the SOFC, in Proc. 4th Eur. Solid Oxide Fuel Cell Forum, edited by A.J. McEvoy (European Fuel Cell Forum, Oberrohrdorf, Switzerland, 2000), pp. 899-906.
    • (2000) Proc. 4th Eur. Solid Oxide Fuel Cell Forum , pp. 899-906
    • Eichler, K.1    Solow, G.2    Otschik, P.3    Schaffrath, W.4
  • 2
  • 3
    • 0001546132 scopus 로고    scopus 로고
    • Structure and composition of interlayers in joints between SiC bodies
    • E. Pippel, J. Woltersdorf, P. Colombo, and A. Donato: Structure and composition of interlayers in joints between SiC bodies. J. Eur. Ceram. Soc. 17, 1259 (1997).
    • (1997) J. Eur. Ceram. Soc. , vol.17 , pp. 1259
    • Pippel, E.1    Woltersdorf, J.2    Colombo, P.3    Donato, A.4
  • 4
    • 0031191287 scopus 로고    scopus 로고
    • Bonding of alumina to metals with Ag-Cu-Zr brazing alloy
    • J-H. Kim and Y-C. Yoo: Bonding of alumina to metals with Ag-Cu-Zr brazing alloy. J. Mater. Sci. Lett. 16, 1212 (1997).
    • (1997) J. Mater. Sci. Lett. , vol.16 , pp. 1212
    • Kim, J.-H.1    Yoo, Y.-C.2
  • 5
    • 0031355639 scopus 로고    scopus 로고
    • Active metal brazing for ceramic-to-metal joining
    • (Int. Microelecton. & Packaging Soc., Reston, VA)
    • M. Powers: Active metal brazing for ceramic-to-metal joining, in Proceedings 1997 International Systems Packaging Symposium (Int. Microelecton. & Packaging Soc., Reston, VA, 1997), p. 124.
    • (1997) Proceedings 1997 International Systems Packaging Symposium , pp. 124
    • Powers, M.1
  • 6
    • 0042510229 scopus 로고    scopus 로고
    • Metal substrate effects on the thermochemistry of active brazing interfaces
    • R. Arroyave and T.W. Eagar: Metal substrate effects on the thermochemistry of active brazing interfaces. Acta Mater. 51, 4871 (2003).
    • (2003) Acta Mater. , vol.51 , pp. 4871
    • Arroyave, R.1    Eagar, T.W.2
  • 7
    • 0028531020 scopus 로고
    • Active brazing alloy containing carbon fibers for metal-ceramic joining
    • M. Zhu and D.D.L. Chung: Active brazing alloy containing carbon fibers for metal-ceramic joining. J. Am. Ceram. Soc. 77, 2712 (1994).
    • (1994) J. Am. Ceram. Soc. , vol.77 , pp. 2712
    • Zhu, M.1    Chung, D.D.L.2
  • 8
    • 27644574918 scopus 로고    scopus 로고
    • Effects of CuO content on the wetting behavior and mechanical properties of a Ag-CuO braze for ceramic joining
    • J.Y. Kim, J.S. Hardy, and K.S. Weil: Effects of CuO content on the wetting behavior and mechanical properties of a Ag-CuO braze for ceramic joining. J. Am. Ceram. Soc. 88, 2521 (2005).
    • (2005) J. Am. Ceram. Soc. , vol.88 , pp. 2521
    • Kim, J.Y.1    Hardy, J.S.2    Weil, K.S.3
  • 9
    • 4444329467 scopus 로고    scopus 로고
    • Joining mixed conducting oxides using an air-fired electrically conductive braze
    • J.S. Hardy, J.Y. Kim, and K.S. Weil: Joining mixed conducting oxides using an air-fired electrically conductive braze. J. Electrochem. Soc. 151, J43 (2004).
    • (2004) J. Electrochem. Soc. , vol.151
    • Hardy, J.S.1    Kim, J.Y.2    Weil, K.S.3
  • 10
    • 29144478414 scopus 로고    scopus 로고
    • Silver-copper oxide based reactive air braze (RAB) for joining yttria-stabilized zirconia
    • J.Y. Kim, J.S. Hardy, and K.S. Weil: Silver-copper oxide based reactive air braze (RAB) for joining yttria-stabilized zirconia. J. Mater. Res. 20, 636 (2005).
    • (2005) J. Mater. Res. , vol.20 , pp. 636
    • Kim, J.Y.1    Hardy, J.S.2    Weil, K.S.3
  • 11
    • 13444287799 scopus 로고    scopus 로고
    • Reactive air brazing: A novel method of sealing SOFCs and other solid-state electrochemical devices
    • K.S. Weil, J.Y. Kim, and J.S. Hardy: Reactive air brazing: A novel method of sealing SOFCs and other solid-state electrochemical devices. Electrochem. Solid-State Lett. 8, A133 (2005).
    • (2005) Electrochem. Solid-State Lett. , vol.8
    • Weil, K.S.1    Kim, J.Y.2    Hardy, J.S.3
  • 12
    • 3142770054 scopus 로고    scopus 로고
    • Use of aluminum in air-brazing aluminum oxide
    • J.Y. Kim, J.S. Hardy, and K.S. Weil: Use of aluminum in air-brazing aluminum oxide. J. Mater. Res. 19, 1717 (2004).
    • (2004) J. Mater. Res. , vol.19 , pp. 1717
    • Kim, J.Y.1    Hardy, J.S.2    Weil, K.S.3
  • 13
    • 0029394511 scopus 로고
    • A comparison of the wettability of copper-copper oxide and silver-copper oxide on polycrystalline alumina
    • A.M. Meier, P.R. Chidambaram, and G.R. Edwards: A comparison of the wettability of copper-copper oxide and silver-copper oxide on polycrystalline alumina. J. Mater. Sci. 30, 4781 (1995).
    • (1995) J. Mater. Sci. , vol.30 , pp. 4781
    • Meier, A.M.1    Chidambaram, P.R.2    Edwards, G.R.3
  • 14
    • 17144473100 scopus 로고    scopus 로고
    • Direct silver bonding - An alternative for substrates in power semiconductor packaging
    • C.C. Shüler, A. Stuck, N. Beck, H. Keser, and U. Täck: Direct silver bonding - An alternative for substrates in power semiconductor packaging. J. Mater. Sci. Mater.-Electron. 11, 389 (2000).
    • (2000) J. Mater. Sci. Mater.-Electron. , vol.11 , pp. 389
    • Shüler, C.C.1    Stuck, A.2    Beck, N.3    Keser, H.4    Täck, U.5
  • 15
    • 0042558285 scopus 로고
    • Some observations on hydrogen embrittlement of silver
    • R.L. Klueh and W.W. Mullins: Some observations on hydrogen embrittlement of silver. Trans. Metall. Soc. AIME 242, 237 (1968).
    • (1968) Trans. Metall. Soc. AIME , vol.242 , pp. 237
    • Klueh, R.L.1    Mullins, W.W.2
  • 16
    • 2942639995 scopus 로고    scopus 로고
    • Observations on the structural degradation of silver during simultaneous exposure to oxidizing and reducing environments
    • P. Singh, Z.G. Yang, V. Viswanathan, and J.W. Stevenson: Observations on the structural degradation of silver during simultaneous exposure to oxidizing and reducing environments. J. Mater. Eng. Perform. 13, 287 (2004).
    • (2004) J. Mater. Eng. Perform. , vol.13 , pp. 287
    • Singh, P.1    Yang, Z.G.2    Viswanathan, V.3    Stevenson, J.W.4
  • 17
    • 0027677759 scopus 로고
    • Equilibrium phase diagrams in the systems PbO-Ag and CuO-Ag
    • Z.B. Shao, K.R. Liu, L.Q. Liu, H.K. Liu, and S. Dou: Equilibrium phase diagrams in the systems PbO-Ag and CuO-Ag. J. Am. Ceram. Soc. 76, 2663 (1993).
    • (1993) J. Am. Ceram. Soc. , vol.76 , pp. 2663
    • Shao, Z.B.1    Liu, K.R.2    Liu, L.Q.3    Liu, H.K.4    Dou, S.5
  • 19
    • 84985097650 scopus 로고
    • Structure and bond strength of a copper-alumina interface
    • Y. Yoshino and T. Shibata: Structure and bond strength of a copper-alumina interface. J. Am. Ceram. Soc. 75, 2756 (1992).
    • (1992) J. Am. Ceram. Soc. , vol.75 , pp. 2756
    • Yoshino, Y.1    Shibata, T.2
  • 20
    • 0028367853 scopus 로고
    • New experimental setup for wettability characterization under monitored oxygen activity: II, wettability of sapphire by silver-oxygen melts
    • D. Chatain, F. Chabert, V. Ghetta, and J. Fouletier: New experimental setup for wettability characterization under monitored oxygen activity: II, wettability of sapphire by silver-oxygen melts. J. Am. Ceram. Soc. 77, 197 (1994).
    • (1994) J. Am. Ceram. Soc. , vol.77 , pp. 197
    • Chatain, D.1    Chabert, F.2    Ghetta, V.3    Fouletier, J.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.