Active metal brazing for ceramic-to-metal joining

Proceedings of the International Systems Packaging Symposium

Volumn , Issue , 1997, Pages 124-128

  Powers, Mike ^a  

^a HEWLETT PACKARD COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; INTERFACES (MATERIALS); MANGANESE; METALLIZING; MOLYBDENUM; SINTERING; VACUUM BRAZING;

ACTIVE METAL BRAZING; CERAMIC TO METAL JOINING;

ELECTRONICS PACKAGING;

EID: 0031355639     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)