Infrared processed Cu composites reinforced with WC particles

Materials Science and Engineering: A

Volumn 429, Issue 1-2, 2006, Pages 58-65

  Deshpande, P K ^a   Li, J H ^a   Lin, R Y ^a  

^a UNIVERSITY OF CINCINNATI   (United States)

Author keywords

Composite hardness; Cu WC composites; Electrical conductivity; Infrared infiltration; Pin on disk tests; Porosity; Wear resistance

Indexed keywords

COPPER; ELECTRIC CONDUCTIVITY; INFILTRATION; MICROHARDNESS; POROSITY; TUNGSTEN; WEAR RESISTANCE; WETTING;

COPPER MATRIX COMPOSITES; FOUR-POINT PROBE METHOD; INFRARED INFILTRATION; PIN-ON-DISK TESTS;

METALLIC MATRIX COMPOSITES;

COPPER; ELECTRIC CONDUCTIVITY; INFILTRATION; METALLIC MATRIX COMPOSITES; MICROHARDNESS; POROSITY; TUNGSTEN; WEAR RESISTANCE; WETTING;

EID: 33745968898     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2006.04.124     Document Type: Article

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