Hybrid health monitoring of structural joints using modal parameters and EMI signatures

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6174 II, Issue , 2006, Pages

  Kim, Jeong Tae ^a   Na, Won Bae ^a   Park, Jae Hyung ^a   Hong, Dong Soo ^a  

^a Pukyong National University   (South Korea)

Author keywords

Damage index method; EMI signatures; Hybrid health monitoring; Modal parameters; Structural joints

Indexed keywords

COMPUTER SIMULATION; CONDITION MONITORING; ELECTRIC IMPEDANCE; MODAL ANALYSIS; SENSORS; VIBRATION MEASUREMENT;

DAMAGE INDEX METHOD; EMI SIGNATURES; HYBRID HEALTH MONITORING; MODAL PARAMETERS;

JOINTS (STRUCTURAL COMPONENTS);

EID: 33745967776     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.661596     Document Type: Conference Paper

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