A high-temperature batch-spray process for implanted resist stripping

Solid State Technology

Volumn 49, Issue 6, 2006, Pages 83-85

  Butterbaugh, Jeffery W ^a   Christenson, Kurt K ^a   Lee, Nam Pyo ^a  

^a FSI International   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MATERIAL LOSS; STRIPPING PROCESS; SURFACE DAMAGE; WET STRIPPING;

CONTAMINATION; HYDROGEN PEROXIDE; PHOTORESISTORS; SULFURIC ACID; WSI CIRCUITS;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 33745951440     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (5)

1. 2003 International Technology Roadmap for Semiconductors, http://public.itrs.net, Executive Summary, Table 5, p. 55.
2. T. Bausum, M. DeSarno, G. Dahrooge, "Stripping High-dose Implanted Resist for 300mm Production," Semicondictor International, Web Exclusive, June 2003.
3. F. Arnaud, H. Bernard, A. Beverina, R. El-Farhane, B. Duriez, K. Barla, D. Levy, "Advanced Surface Cleaning Strategy for 65nm CMOS Device Performance Enhancement," Ultra Clean Processing of Silicon Surfaces VII, Solid State Phenomena, Vols. 103-104, pp. 37-40, 2005.
4. Lee M. Lowenstein, Srikanth Krishnan, George A. Brown, "Damage During Ashing: A Characterization of Several Modern Ashers," Electrochemical Society Proceedings, Vol. 95-20, pp. 225-234, 1995.
5. Steven Verhaverbeke, Kurt Christenson, "Organic Contamination Removal," in Contamination-Free Manufacturing for Semiconductors and Other Precision Products, ed. Robert P. Donovan, pp. 320-322, 2001.