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Volumn 82, Issue 7, 2006, Pages 671-696
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Thermal fluctuations limit the adhesive strength of compliant solids
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Author keywords
Adhesive strength; Compliance; Statistical model; Thermal fluctuation; Work of adhesion
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Indexed keywords
ELASTIC MODULI;
INTERFACES (MATERIALS);
STRENGTH OF MATERIALS;
STRESS ANALYSIS;
THERMAL EFFECTS;
ADHESIVE STRENGTH;
COMPLIANT SOLIDS;
THERMAL FLUCTUATIONS;
ADHESION;
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EID: 33745859722
PISSN: 00218464
EISSN: 15455823
Source Type: Journal
DOI: 10.1080/00218460600775781 Document Type: Article |
Times cited : (27)
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References (21)
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