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Volumn 82, Issue 7, 2006, Pages 671-696

Thermal fluctuations limit the adhesive strength of compliant solids

Author keywords

Adhesive strength; Compliance; Statistical model; Thermal fluctuation; Work of adhesion

Indexed keywords

ELASTIC MODULI; INTERFACES (MATERIALS); STRENGTH OF MATERIALS; STRESS ANALYSIS; THERMAL EFFECTS;

EID: 33745859722     PISSN: 00218464     EISSN: 15455823     Source Type: Journal    
DOI: 10.1080/00218460600775781     Document Type: Article
Times cited : (27)

References (21)
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    • Gent, A. N. and Wang, C., J. Mater. Sci. 26, 3392-3395 (1991). [CSA] [CROSSREF]
    • (1991) J. Mater. Sci. , vol.26 , pp. 3392-3395
    • Gent, A.N.1    Wang, C.2
  • 7
    • 0024630763 scopus 로고
    • [CSA] [CROSSREF]
    • Schapery, R. A., Int. J. Fracture 39, 163-189 (1989). [CSA] [CROSSREF]
    • (1989) Int. J. Fracture , vol.39 , pp. 163-189
    • Schapery, R.A.1
  • 15
    • 0000510334 scopus 로고    scopus 로고
    • [CSA] [CROSSREF]
    • Chaudhury, M. K., J. Phys. Chem. B 103, 6562-6566 (1999). [CSA] [CROSSREF]
    • (1999) J. Phys. Chem. B , vol.103 , pp. 6562-6566
    • Chaudhury, M.K.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.