Evaluation of microwave material of low K interconnection for RF package

Microwave and Optical Technology Letters

Volumn 48, Issue 8, 2006, Pages 1675-1678

  Weng, Min Hang ^a   Wu, Hung Wei ^b   Su, Yan Kuin ^b   Yang, Ru Yuan ^b   Hung, Cheng Yuan ^b  

^a NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Dielectric properties; Interconnection; Low K; Multichip module (MCM); Polyimide; System in package (SIP)

Indexed keywords

ELECTRONICS PACKAGING; MICROPROCESSOR CHIPS; MICROWAVES; NATURAL FREQUENCIES; PERMITTIVITY; POLYIMIDES;

INTERCONNECTION; LOW K; MULTICHIP MODULE (MCM); SYSTEM IN PACKAGE (SIP);

OPTICAL INTERCONNECTS;

EID: 33745799452     PISSN: 08952477     EISSN: None     Source Type: Journal    
DOI: 10.1002/mop.21707     Document Type: Article

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