Electrodeposition of organic dielectric film and its application to vibrational microelectromechanical system devices

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 45, Issue 6 B, 2006, Pages 5646-5649

  Sakata, Tomomi ^a   Ishii, Hiromu ^a   Sato, Norio ^a   Shimamura, Toshishige ^a   Kuwabara, Kei ^a   Kudou, Kazuhisa ^b   Machida, Katsuyuki ^a  

^a NTT CORPORATION   (Japan)

^b NTT Advanced Technology Corporation   (Japan)

Author keywords

Electrodeposition; MEMS; Release ashing; Reliability; Uniform coating

Indexed keywords

ELECTRODEPOSITION; ELECTRODES; GOLD; MICROELECTROMECHANICAL DEVICES; RELIABILITY; X RAY PHOTOELECTRON SPECTROSCOPY;

COMB-SHAPED ELECTRODES; OXYGEN PLASMA EXPOSURE; RELEASE ASHING; UNIFORM COATING;

DIELECTRIC FILMS;

EID: 33745635881     PISSN: 00214922     EISSN: 13474065     Source Type: Journal    
DOI: 10.1143/JJAP.45.5646     Document Type: Review

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