Strength improvement of a smart adhesive bonded joint system by partially integrated piezoelectric patches

Journal of Adhesion Science and Technology

Volumn 20, Issue 6, 2006, Pages 503-518

  Cheng, Jinquan ^a   Taheri, Farid ^a   Han, Haipeng ^a  

^a DALHOUSIE UNIVERSITY   (Canada)

Author keywords

Active control; Adhesively bonded joints; Experimental; Piezoelectrics; Smart joint; Strengthening

Indexed keywords

ACTUATORS; ELECTRIC FIELD EFFECTS; PIEZOELECTRIC DEVICES; PIEZOELECTRIC MATERIALS; SENSORS; STRESS CONCENTRATION; THEOREM PROVING; ELECTRIC FIELDS; PIEZOELECTRICITY; STRENGTHENING (METAL);

ACTIVE CONTROL; ADHESIVELY BONDED JOINTS; EXPERIMENTAL; SMART JOINT; STRENGTHENING;

ADHESIVE JOINTS;

ACTIVE CONTROL; ADHESIVELY BONDED JOINTS; EXPERIMENTAL; PIEZOELECTRICS; SMART JOINT;

EID: 33745597867     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856106777213285     Document Type: Article

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