Improving scanner productivity and control through innovative connectivity application

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6152 II, Issue , 2006, Pages

  Ishii, Yuuki ^a   Wakamoto, Shinji ^a   Kato, Atsuhiko ^b   Eichelberger, Brad ^b  

^a NIKON CORPORATION   (Japan)

^b KLA TENCOR CORPORATION   (United States)

Author keywords

APC; GCM; Mix Match overlay; Scanner Metrology Link; SDM

Indexed keywords

APC; GCM; MIX & MATCH OVERLAY; SCANNER-METROLOGY LINK; SDM;

BUDGET CONTROL; ERROR ANALYSIS; FEEDBACK; PROCESS CONTROL; PRODUCTIVITY; SCANNING;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 33745590110     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.656094     Document Type: Conference Paper

References (2)

1. K. Takahisa, Y. Ishii and N. Tokuda, "Induction of New Techniques for Matching Overlay Enhancement" Prc. SPIE, Vol. 4346, pp. 1608-1616, 2001
2. T. Umatate, "Method for Successive Alignment of Chip Patterns on a Substrate," US Patent, 4,780,617, 1988.