Reducing the cost of inert soldering

Circuits Assembly

Volumn 9, Issue 7, 1998, Pages 46-52

  Theriault, Martin ^a   Blostein, Philippe ^b  

^a AIR LIQUIDE   (France)

^b Air Liguide Group

Author keywords

[No Author keywords available]

Indexed keywords

EID: 11744285415     PISSN: 10540407     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (5)

1. Rahn, A. (Aug./Sept. 1997). Nitrogen for flow and reflow soldering. Surface Mount Technology Association Newsletter.
2. Thibault, Bell, Lemieux. (1998). Reduction of residue using various atmospheres. Proceedings of the Technical Session. NEPCON West.
3. N.R. Cox. (1995). The influence of varying input gas flow on the performance of a nitrogen/convection oven. Proceedings of the Technical Session. NEPCON West.
4. Langston, Chance, Smith. (1997). Conserving nitrogen at reflow. Proceedings of the Technical Session. NEPCON West.
5. Heller, D. (Nov. 1997). Introducing closed-loop nitrogen control, Circuits Assembly, Nov. 1997, 42-46.