Fluorinated amorphous carbon thin films for multilevel interconnections of integrated circuits

Journal of Photopolymer Science and Technology

Volumn 12, Issue 2, 1999, Pages 193-198

  Tatsumi, Toru ^a   Endo, Kazuhiko ^a  

^a NEC CORPORATION   (Japan)

Author keywords

Fluorinated amorphous carbon; Low dielectric constant interlayer dielectrics; Multilevel interconnection; Plasma enhanced chemical vapor deposition

Indexed keywords

EID: 33745547394     PISSN: 09149244     EISSN: None     Source Type: Journal    
DOI: 10.2494/photopolymer.12.193     Document Type: Article

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