Self-teaching setup for reflow soldering process

28th International Spring Seminar on Electronics Technology: Meeting the Challenges of Electronics Technology Progress, 2005

Volumn 2005, Issue , 2005, Pages 308-312

  Simion Zanescu, Daniel ^a   Svasta, Paul ^a   Streza, Florin ^a  

^a IEEE   (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

CONVECTION DISTRIBUTION; DISSIPATION MANAGEMENT; ELECTRONIC MODULES; THERMAL MANAGEMENT;

ELECTRIC OVENS; ENERGY ABSORPTION; HEAT LOSSES; SELF ORGANIZING MAPS; SOLDERING; THERMOANALYSIS;

ELECTRONICS ENGINEERING;

EID: 33745472894     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2005.1491046     Document Type: Conference Paper

References (3)

1. P.Svasta. D. Simion-Zanescu, "Modeling Optimization Techniques for PCB Thermal Simulations", 2002, Prague, ISSE Conference Proceedings
2. P.Svasta. D. Simion-Zanescu, "Thermal Limits in Reflow Soldering Process", 2003, New Orleans, 53rd ECTC Conference Proceedings
3. D. Whalley, "A simplified model for reflow oven", ISSE-Conference Proceedings, 2002 May, Prague, Czech Republic