Thermal limits in reflow soldering process

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 1839-1842

  Svasta, Paul ^a   Simion Zanescu, Daniel ^a  

^a UNIVERSITY POLITEHNICA OF BUCHAREST   (Romania)

Author keywords

[No Author keywords available]

Indexed keywords

ALGORITHMS; HEAT CONVECTION; INFRARED RADIATION; PHASE TRANSITIONS; SEMICONDUCTOR JUNCTIONS; SOLDERED JOINTS; SOLDERING; THERMAL EFFECTS;

REFLOW SOLDERING PROCESS; THERMAL ZONE;

ELECTRONICS PACKAGING;

EID: 0037673690     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Tummala, R. et al, Microelectronics Packaging Handbook, Subsystem Packaging, Chapman & Hall (New York, 1997), pp. III-129-III 169 65-67. pp. III-129-III 169 65-67.
2. Scheel, W., Baugruppentechnologie der Elektronik-Montage, Verlag Technik (Berlin, 1997) pp.298-312.
3. Prasad, R.P., Surface Maunt Technology- Principles and Practice, Chapmann & Hall, 1997, pp. 145-160.
4. Çengel Y.A., Turner R.H., Fundamentals of Thermal -Fluid Science, McGrow Hill (New York, 2001), pp 414-431.
5. Svasta, P., Simion-Zanescu, D., "Thermal Conductivity Influence in SMT reflow Soldering Process" Proc 52nd Electronic Components and Technology Conf, San Diego California, May 2002 pp 1613-1617.