Materials compatibility issues in LTCC technology and their effects on structural and electrical properties

Proceedings - 2005 IMAPS/ACerS 1st International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2005

Volumn , Issue , 2005, Pages 300-309

  Birol, H ^a   Maeder, T ^a   Ryser, P ^a  

^a EPFL   (Switzerland)

Author keywords

Co firing; Differential shrinkage; LTCC; Microstructure; Positive temperature coefficient

Indexed keywords

CO-FIRING; DIFFERENTIAL SHRINKAGE; LOW TEMPERATURE CO-FIRED CERAMICS; LTCC; MICRO-ELECTRONIC DEVICES; PROCESSING CONDITION; STRUCTURAL AND ELECTRICAL PROPERTIES; TEMPERATURE COEFFICIENT OF RESISTANCE;

CERAMIC MATERIALS; EXHIBITIONS; MICROSTRUCTURE; MICROSYSTEMS; POSITIVE TEMPERATURE COEFFICIENT; SHRINKAGE; TECHNOLOGY;

ELECTRIC PROPERTIES;

EID: 33745451572     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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