Sulfidation of a Cu submonolayer at the Au(1 1 1)/electrolyte interface - An in situ STM study

Surface Science

Volumn 600, Issue 13, 2006, Pages 2800-2809

  Friebel, Daniel ^a   Schlaup, Christian ^a   Broekmann, Peter ^a   Wandelt, Klaus ^a  

^a UNIVERSITY OF BONN   (Germany)

Author keywords

Copper; Electrochemical phenomena; Gold; Metal electrolyte interfaces; Scanning tunneling microscopy; Semiconducting films; Sulphides; Surface chemical reaction

Indexed keywords

COPPER; ELECTROCHEMISTRY; ELECTROLYTES; GOLD; INTERFACES (MATERIALS); SCANNING TUNNELING MICROSCOPY;

ELECTROCHEMICAL PHENOMENA; METAL-ELECTROLYTE INTERFACES; SURFACE CHEMICAL REACTION;

MONOLAYERS;

EID: 33745265639     PISSN: 00396028     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.susc.2006.05.007     Document Type: Article

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