A passivated electrode batch μEDM technology for bulk metal transducers and packages

Proceedings of IEEE Sensors

Volumn 2005, Issue , 2005, Pages 219-222

  Richardson, Mark T ^a   Gianchandani, Yogesh B ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRODES; ELECTRONICS PACKAGING; ELECTROPLATING; LITHOGRAPHY; STAINLESS STEEL; TRANSDUCERS; WEAR OF MATERIALS;

DISCHARGE BARRIERS; HIGH DENSITY PATTERNS; METAL RECASTING; SPURIOUS DISCHARGES;

ELECTRIC DISCHARGE MACHINING;

EID: 33745178960     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICSENS.2005.1597675     Document Type: Conference Paper

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