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Volumn 35, Issue 5, 2006, Pages 1087-1094

Effect of the polymer matrices on the dielectric behavior of a percolative high-k polymer composite for embedded capacitor applications

Author keywords

Dielectric properties; Embedded capacitors; Polymer composites

Indexed keywords

ALUMINUM; COMPOSITE MATERIALS; PERMITTIVITY; POLYIMIDES; SILICONES;

EID: 33745074123     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692571     Document Type: Conference Paper
Times cited : (21)

References (16)
  • 1
    • 1242350938 scopus 로고    scopus 로고
    • R.R. Tummala, ed. (New York: McGraw-Hill)
    • R.R. Tummala, ed., Fundamentals of Microsystems Packaging (New York: McGraw-Hill, 2001), pp. 422-464.
    • (2001) Fundamentals of Microsystems Packaging , pp. 422-464
  • 8
    • 33745069158 scopus 로고    scopus 로고
    • U.S. patent 6,864,306
    • Y. Rao, C.P. Wong, and J. Xu, U.S. patent 6,864,306 (2005).
    • (2005)
    • Rao, Y.1    Wong, C.P.2    Xu, J.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.