Mechanical properties of intermetallic compounds on lead-free solder by moiré techniques

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 1059-1066

  Tsai, Iting ^a   Wu, Enboa ^b   Yen, S F ^a   Chuang, T H ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE   (Hong Kong)

Author keywords

Coefficients of thermal expansion (CTE); Intermetallic compound (IMC); Lead free

Indexed keywords

ELASTIC MODULI; GENETIC ALGORITHMS; INTERFACES (MATERIALS); METALLIZING; NANOTECHNOLOGY; SOLDERING ALLOYS; THIN FILMS; TIN ALLOYS;

BUMP METALLIZATION; COEFFICIENTS OF THERMAL EXPANSION (CTE); LEAD-FREE SOLDERS; METAL SUBSTRATES;

SEMICONDUCTING INTERMETALLICS;

EID: 33745011894     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692567     Document Type: Conference Paper

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