Functional integration in active IPEM by using a planar integration technology

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 1, Issue , 2005, Pages 375-381

  Liang, Zhenxian ^a   Van Wyk, J D ^a  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; EMBEDDED SYSTEMS; LOGIC DESIGN; METALLIZING; MICROPROCESSOR CHIPS; POWER ELECTRONICS; SWITCHING CIRCUITS;

EMBEDDED POWER; INTEGRATED PROCESS MODULES; MICROCIRCUITS MANUFACTURING PROCESS; PLANAR INTEGRATION TECHNOLOGY;

DIGITAL INTEGRATED CIRCUITS;

EID: 33745007584     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. th Applied Power Electronics Conference and Exposition, Vol.1, 2002 pp.106-111.
2. http://www.hitachisemiconductor.com/sic/jsp/japan/jpn/P RODUCTS
3. R. Fillion, E.Delgado, P. McConnelee, and R. Beaupre, "A High Performance Polymer Thin Film Power Electronics Packaging Technology, Advancing Microelectronics, Sept./Oct., 2003, pp.7-12
4. Siemens, "Electrical, Thermal and reliability Aspects of SiPLIT Bond-wireless Power Modules," in PESC'04, Aachen, Germany, June, 2004.
5. th IAS Annual Meeting), Oct 12-16, 2003, Salt Lake City, Utah.
6. S. S. Tonapi, R. A. Filiion, F. J. Schattenmann, H. S. Cole, J. D. Evans, and B. G. Sammakia, "An Overview of Thermal Management for Next Generation Microelectronic Devices," Procs. of 2003 IEEE/SEMI Advanced Manufacturing Conference, 2003, pp250-254.
7. Zhenxian Liang, Fred C. Lee, and Guo-quan Lu, "Embedded Power-an Integration Packaging Technology for IPEMs," International Journal of Microcircuit & Electronic Packaging, Vol.23, No.4, pp.481-487, 2000.
8. th Annual, vol. 2, pp. 651-657, Feb. 2003.
9. N. Zhu, J. D. van Wyk and Z. Liang, "Increased Functional Integration of Embedded Power Technology by Embedding the Decoupling Capacitor," to appear in the Procs. of CPES 2004 Annual Seminar, Blacksburg, VA, April 2004.
10. Y. Pang, E. Scott, J. D. van Wyk, and Z. Liang, "Assessment of Some Integrated Cooling Mechanics for an Active IPEM," to appear in the Procs. of CPES 2004 Annual Seminar, Blacksburg, VA, April 2004.
11. J. Xu, L. Zhao, Z. Liang and J. D. van Wyk, "Embedded Bi-Planar Coil Based Integrated Current Sensor for Power Module Integration," to appear in the Procs. of CPES 2004 Annual Seminar, Blacksburg, VA, April 2004.
12. D. Cochrane, D.Y. Chen, D. Boroyevich, "Passive Cancellation of Common-Mode Noise in Power Electronic Circuits," Power Electronics, IEEE Transactions on, vol 1, no. 3, pp. 756-763, May 2003.
13. th IAS Annual Meeting), Oct 12-16, 2003, Salt Lake City, Utah.