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Volumn 1, Issue , 2005, Pages 362-368

Design of integrated LLCT module for LLC resonant converter

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL INTEGRATED CIRCUITS; ELECTROMAGNETISM; ENERGY DISSIPATION; LOGIC CIRCUITS; MAGNETIC FIELD EFFECTS; PRODUCT DESIGN; RESONANT CIRCUITS;

EID: 33745004815     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2005.1452954     Document Type: Conference Paper
Times cited : (35)

References (14)
  • 4
    • 1642461455 scopus 로고    scopus 로고
    • Design of planar integrated passive module for zero-voltage-switched asymmetrical half-bridge PWM converter
    • R. Chen, J. T. Strydom and J. D. van Wyk, "Design of Planar Integrated Passive Module for Zero-Voltage-Switched Asymmetrical Half-Bridge PWM Converter," Industry Applications, IEEE Transactions, vol. 39, No. 6, pp. 1648-1655
    • Industry Applications, IEEE Transactions , vol.39 , Issue.6 , pp. 1648-1655
    • Chen, R.1    Strydom, J.T.2    Van Wyk, J.D.3
  • 5
    • 0036446132 scopus 로고    scopus 로고
    • Second order approximation lumped parameter model for planar integrated L-L-C-T module
    • R. Chen, J. T. Strydom and J. D. van Wyk, "Second Order Approximation Lumped Parameter Model for Planar Integrated L-L-C-T Module," Industry Applications Conference, IAS'02, vol.4, pp. 2419-2424.
    • Industry Applications Conference, IAS'02 , vol.4 , pp. 2419-2424
    • Chen, R.1    Strydom, J.T.2    Van Wyk, J.D.3
  • 9
    • 1642543204 scopus 로고    scopus 로고
    • A planar multicell structure for advanced integrated reactive power modules
    • L. Zhao, J. T. Strydom and J. D. van Wyk, "A Planar Multicell Structure for Advanced Integrated Reactive Power Modules," Industry Applications, IEEE Trans. vol. 39, No. 6, pp. 1656-1664.
    • Industry Applications, IEEE Trans. , vol.39 , Issue.6 , pp. 1656-1664
    • Zhao, L.1    Strydom, J.T.2    Van Wyk, J.D.3
  • 10
    • 0043160147 scopus 로고    scopus 로고
    • High density integrated electromagnetic power passives with vertical interconnect and stacked structure
    • W. Liu, J. D. van Wyk and W. G. Odendaal, "High Density Integrated Electromagnetic Power Passives with Vertical Interconnect and Stacked Structure," Power Electronics Specialist, PESC'03, vol. 1, pp.442-447.
    • Power Electronics Specialist, PESC'03 , vol.1 , pp. 442-447
    • Liu, W.1    Van Wyk, J.D.2    Odendaal, W.G.3
  • 13
    • 0028134438 scopus 로고    scopus 로고
    • Improved analytical modeling of conductive losses in magnetic components
    • J. A. Ferreira, "Improved Analytical Modeling of Conductive Losses in Magnetic Components," Power Electronics, IEEE Trans. vol. 9, No. 1, pp. 127-131
    • Power Electronics, IEEE Trans. , vol.9 , Issue.1 , pp. 127-131
    • Ferreira, J.A.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.