Rapid curing of positive tone photosensitive polybenzoxazole based dielectric resin by variable frequency microwave processing

IEEE Transactions on Components and Packaging Technologies

Volumn 29, Issue 2, 2006, Pages 411-419

  Tanikella, Ravindra V ^a   Sung, Taehyun ^b   Bidstrup Allen, Sue Ann ^b   Kohl, Paul A ^b  

^a INTEL CORPORATION   (United States)

^b Georgia Institute of Technology   (United States)

Author keywords

Dielectrics; Infrared (IR); Microwave curing; Passivation; Photosensitive polymer; Polybenzoxazole

Indexed keywords

CHARACTERIZATION; CURING; DIELECTRIC MATERIALS; ELECTRIC PROPERTIES; MECHANICAL PROPERTIES; OPTICAL PROPERTIES; THERMOANALYSIS; THERMODYNAMIC PROPERTIES;

DIELECTRIC RESIN; MICROWAVE CURING; PHOTOSENSITIVE POLYBENZOXAZOLE; PHOTOSENSITIVE POLYMER; VARIABLE FREQUENCY MICROWAVE PROCESSING;

POLYMERS;

EID: 33744824939     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2006.875882     Document Type: Article

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