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Volumn 17, Issue 3, 2006, Pages 533-541

Relationship between the dielectric and mechanical properties and the ratio of epoxy resin to hardener of the hybrid thermosetting polymers

Author keywords

Dielectric analysis; Dieletric relaxation; Epoxy resin; Thermosetting materials

Indexed keywords


EID: 33744778706     PISSN: 01035053     EISSN: 01035053     Source Type: Journal    
DOI: 10.1590/S0103-50532006000300016     Document Type: Article
Times cited : (53)

References (41)
  • 19
  • 29
    • 0022107271 scopus 로고
    • Boyd, R.H.; Polymer 1985, 26, 1123.
    • (1985) Polymer , vol.26 , pp. 1123
    • Boyd, R.H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.