Test methods used to produce highly reliable known good die (KGD)

Proceedings - 1998 International Conference on Multichip Modules and High Density Packaging

Volumn 1998-April, Issue , 1998, Pages 374-382

  Arnold, R ^a   Menon, S M ^a   Brackett, B ^a   Richmond, R ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MICROPROCESSOR CHIPS; MULTICHIP MODULES;

COST PROHIBITIVE; HIGHLY RELIABLE; KNOWN-GOOD DIES; RELIABILITY LEVEL; SINGULATED DIE; TEMPERATURE TEST; TEST RELIABILITY; TEST TECHNOLOGY;

TESTING;

EID: 33744513386     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMCM.1998.670811     Document Type: Conference Paper

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