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Volumn 53, Issue 6, 2006, Pages 187-194
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Parameter optimization and design aspect for electrocoagulation of silica nano-particles in wafer polishing wastewater
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Author keywords
CMP; Electrocoagulation; Nano particle; Silica colloids; Slurry; Wafer polishing
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Indexed keywords
CHEMICAL MECHANICAL PLANARIZATION;
ELECTROCOAGULATION;
WAFER POLISHING;
COAGULATION;
COLLOIDS;
CURRENT DENSITY;
DESIGN;
OPTIMIZATION;
PH;
REACTION KINETICS;
REMOVAL;
SILICA;
SLURRIES;
CHEMICAL REACTORS;
NANOPARTICLE;
SILICATE;
CHEMICAL REACTORS;
COAGULATION;
COLLOIDS;
CURRENT DENSITY;
DESIGN;
OPTIMIZATION;
PH;
REACTION KINETICS;
REMOVAL;
SILICA;
SLURRIES;
COAGULATION;
OPTIMIZATION;
SLURRY;
WASTEWATER;
ARTICLE;
CHEMICAL REACTION KINETICS;
CONTINUOUS FLOW REACTOR;
EQUIPMENT DESIGN;
EXPERIMENTAL MODEL;
HYDRAULIC CONDUCTIVITY;
INTERMETHOD COMPARISON;
NANOTECHNOLOGY;
NONHUMAN;
PH;
REACTOR OPTIMIZATION;
STEADY STATE;
VALIDATION PROCESS;
WASTE COMPONENT REMOVAL;
WASTE WATER MANAGEMENT;
BIOREACTORS;
ELECTROCOAGULATION;
ELECTRODES;
EQUIPMENT DESIGN;
KINETICS;
NANOTECHNOLOGY;
SILICON DIOXIDE;
WASTE DISPOSAL, FLUID;
WATER POLLUTANTS, CHEMICAL;
WATER PURIFICATION;
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EID: 33744465513
PISSN: 02731223
EISSN: None
Source Type: Book Series
DOI: 10.2166/wst.2006.195 Document Type: Article |
Times cited : (6)
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References (9)
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