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Volumn 57, Issue 2, 2006, Pages 219-230

Cure behavior of epoxy resin/CdS/2,4-EMI nanocomposites investigated by dynamic torsional vibration method(DTVM)

Author keywords

[No Author keywords available]

Indexed keywords

AGENTS; CURING; GELATION; MOLECULAR VIBRATIONS; NANOSTRUCTURED MATERIALS;

EID: 33646797075     PISSN: 01700839     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00289-006-0550-2     Document Type: Article
Times cited : (8)

References (30)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.