Correlation between silicon-nitride film stress and composition: XPS and SIMS analyses

Surface and Interface Analysis

Volumn 38, Issue 4, 2006, Pages 723-726

  Vanzetti, L ^a   Barozzi, M ^a   Giubertoni, D ^a   Kompocholis, C ^a   Bagolini, A ^a   Bellutti, P ^a  

^a ITC IRST   (Italy)

Author keywords

Film stress; PECVD silicon nitride; SIMS; XPS

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ETCHING; MICROELECTROMECHANICAL DEVICES; PLASMAS; SECONDARY ION MASS SPECTROMETRY; STRESSES; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY;

FILM STRESSES; HF ETCH-BACK METHODS; PECVD SILICON NITRIDE; PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD);

SILICON NITRIDE;

EID: 33646576243     PISSN: 01422421     EISSN: 10969918     Source Type: Journal    
DOI: 10.1002/sia.2284     Document Type: Conference Paper

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