Catalytic abatement of volatile organic compounds assisted by non-thermal plasma. Part II. Optimized catalytic electrode and operating conditions

Applied Catalysis B: Environmental

Volumn 65, Issue 1-2, 2006, Pages 157-162

  Subrahmanyam, Ch ^a   Renken, A ^a   Kiwi Minsker, L ^a  

^a EPFL   (Switzerland)

Author keywords

Dielectric barrier discharge; Non thermal plasma; Plasma assisted catalysis; Sintered metal fibers; Volatile organic compound abatement

Indexed keywords

DIELECTRIC MATERIALS; ELECTRODES; OXIDATION; PLASMA APPLICATIONS; SINTERING; VOLATILE ORGANIC COMPOUNDS;

DIELECTRIC BARRIER DISCHARGES; NON-THERMAL PLASMA; PLASMA-ASSISTED CATALYSIS; SINTERED METAL FIBERS; VOLATILE ORGANIC COMPOUND ABATEMENTS;

CATALYST ACTIVITY;

EID: 33646192136     PISSN: 09263373     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apcatb.2006.02.024     Document Type: Article

References (26)

1. Kim H.H. Plasma Process. Polym. 1 (2004) 91
2. Francke K.P., Miessner H., and Rudolph R. Plasma Chem. Plasma Process. 20 (2000) 393
3. Magureanu M., Mandache N.B., Eloy P., Gaigneaux E.M., and Parvulescu V.I. Appl. Catal. B Environ. 61 (2005) 13
4. Futamura S., Einaga H., Kabashima H., and Hwan L.Y. Catal. Today 89 (2004) 89
5. Bogaerts A., Neyts E., Gijbels R., and Mullen J. Spectrochim. Acta B 57 (2002) 609
6. Xu X. Thin Solid Films 390 (2001) 237
7. Roland U., Holzer F., and Kopinke F.D. Catal. Today 73 (2002) 315
8. Futamura S., Zhang A., Prieto G., and Yamamoto T. IEEE Trans. Ind. Appl. 34 (1998) 967
9. Tevault D.E. Plasma. Chem. Plasma Process. 7 (1987) 231
10. Holzer F., Roland U., and Kopinke F.D. Appl. Catal. B Environ. 38 (2002) 163
11. Francke K.P., Miessner H., and Rudolph R. Catal. Today 59 (2000) 411
12. Penetratnte B., Hsiao M.C., Bardsley J.N., Merrit B.T., Vogtlin G.E., Kuthi A., Burkhart C.P., and Bayless J.R. Plasma Source Sci. Technol. 6 (1997) 251
13. Yamamoto T., Mizuno I.K., Tamori I., Ogata A., Nifuku M., Michalska M., and Prieto G. IEEE Trasns. Ind. Appl. 32 (1996) 100
14. Roland U., Holzer F., and Kopinke F.D. Appl. Catal. B Environ. 58 (2005) 217
15. Roland U., Holzer F., and Kopinke F.D. Appl. Catal. B Environ. 58 (2005) 227
16. Kirkpatrick M.J., Finney W.C., and Locke B.R. Catal. Today 89 (2004) 117
17. Ayrault C., Barrault J., Blin-Simiand N., Jorand F., Pasquiers S., Rousseau A., and Tatibouet J.M. Catal. Today 89 (2004) 75
18. Futamura S., Zhang A., and Yamamoto T. J. Electrostat. 42 (1997) 51
19. Demidiouk V., Moon S.I., and Chae J.O. Catal. Commun. 4 (2003) 51
20. Ogata A., Mizuno K., Kushiyama S., and Yamamoto T. Plasma Chem. Plasma Process. 19 (1999) 383
21. Yuranov I., Kiwi-Minsker L., and Renken A. Appl. Catal. B Environ. 43 (2003) 217
22. Subrahmanyam Ch., Magureanu M., Renken A., and Kiwi-Minsker L. Appl. Catal. B Environ. 65 (2006) 150-156
23. Kim H.H., Oh S.M., Ogata A., and Futamura S. Appl. Catal. B Environ. 56 (2005) 213
24. Einaga H., Ibusuki T., and Futamura S. IEEE Trans. Ind. Appl. 37 (2001) 1476
25. Subrahmanyam Ch., Bulushev D.A., and Kiwi-Minsker L. Appl. Catal. B Environ. 61 (2005) 98
26. Li W., Gibbs G.V., and Oyama S.T. J. Am. Chem. Soc. 120 (1998) 9041