Anodic behaviour of a model second phase: Al-20at.%Mg-20at.%Cu

Corrosion Science

Volumn 48, Issue 5, 2006, Pages 1225-1248

  Liu, Y ^a   Arenas, M A ^a   Skeldon, P ^a   Thompson, G E ^a   Bailey, P ^b   Noakes, T C Q ^b   Habazaki, H ^c   Shimizu, K ^d  

^a UNIVERSITY OF MANCHESTER   (United Kingdom)

^b DARESBURY LABORATORY   (United Kingdom)

^c HOKKAIDO UNIVERSITY   (Japan)

^d KEIO UNIVERSITY   (Japan)

Author keywords

Aluminium; Anodic films; Anodic oxidation; Copper; Magnesium; Passive films; S phase

Indexed keywords

ALUMINUM; ALUMINUM ALLOYS; ANODIC OXIDATION; ANODIC PROTECTION; COMPOSITION; COPPER; ELECTROLYTES; MAGNESIUM PRINTING PLATES; PASSIVATION; SPUTTER DEPOSITION; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

ANODIC FILMS; PASSIVE FILMS; POTENTIODYNAMIC POLARIZATION; S-PHASE;

CORROSION RESISTANT ALLOYS;

ALUMINUM; ALUMINUM ALLOYS; ANODIC OXIDATION; ANODIC PROTECTION; COMPOSITION; COPPER; CORROSION RESISTANT ALLOYS; ELECTROLYTES; MAGNESIUM PRINTING PLATES; PASSIVATION; SPUTTER DEPOSITION; TRANSMISSION ELECTRON MICROSCOPY; X RAY PHOTOELECTRON SPECTROSCOPY;

EID: 33646072792     PISSN: 0010938X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.corsci.2005.05.007     Document Type: Article

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