Design of thermal interface material with high thermal conductivity and measurement apparatus

Journal of Electronic Packaging

Volumn 128, Issue 1, 2006, Pages 46-52

  Park, Jong Jin ^a   Taya, Minoru ^a  

^a University of Washington   (United States)

Author keywords

Resistor network model; Thermal impedance; Thermal interface material; Thermal resistance; Thermometer; Thin film

Indexed keywords

CARBON NANOTUBES; HEAT RESISTANCE; MATHEMATICAL MODELS; MEASUREMENT THEORY; THERMAL CONDUCTIVITY; TITANIUM COMPOUNDS;

CHLOROFORM; SILICON THERMAL GREASE; THERMAL INTERFACE MATERIAL (TIM); TITANIUM TUNGSTEN (TIW) LAYERS;

INTERFACES (MATERIALS);

EID: 33646016595     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2159008     Document Type: Article

References (11)

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