A model for flow bypass and tip leakage in pin fin heat sinks

Journal of Electronic Packaging

Volumn 128, Issue 1, 2006, Pages 53-60

  Dogruoz, M Baris ^a   Ortega, Alfonso ^a   Westphal, Russell V ^b  

^a University of Arizona   (United States)

^b WASHINGTON STATE UNIVERSITY   (United States)

Author keywords

Bypass; Electronics cooling; Heat sink; Pin fins; Tip leakage

Indexed keywords

COOLING; FINS (HEAT EXCHANGE); FLOW OF FLUIDS; HEAT TRANSFER; HYDRAULICS; LEAKAGE (FLUID); PRESSURE DROP;

BYPASS; ELECTRONICS COOLING; MOMENTUM EQUATIONS; PIN FINS; TIP LEAKAGE;

HEAT SINKS;

EID: 33645968685     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2159009     Document Type: Article

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