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Volumn , Issue , 2002, Pages 425-432

Enhancement of the cooling performance of circular pin fin heat sinks under flow bypass conditions

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COOLING; HEAT TRANSFER; HEAT TRANSFER COEFFICIENTS; PRESSURE DROP; TURBULENT FLOW;

EID: 0036455472     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (8)

References (18)
  • 1
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  • 2
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    • Heat transfer and pressure dorp for a staggered wall-attached array of cylinders with tip clearance
    • Sparrow, E.M., Ramsey, J.W., 1978, Heat transfer and Pressure Dorp for a Staggered Wall-Attached Array of Cylinders with Tip Clearance, Int. J. Heat Mass Transfer, Vol. 21, pp. 1369-1377.
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    • Sparrow, E.M.1    Ramsey, J.W.2
  • 3
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    • Experiments on in-line pin fin arrays and performance comparisons with staggered arrays
    • Febr. 1980
    • Sparrow, E.M., Ramsey, J.W., Altemani, C.A.C., 1980, Experiments on In-Line Pin Fin Arrays and Performance Comparisons with Staggered Arrays, ASME J. Heat Transfer, Vol. 102, Febr. 1980, pp. 44-50.
    • (1980) ASME J. Heat Transfer , vol.102 , pp. 44-50
    • Sparrow, E.M.1    Ramsey, J.W.2    Altemani, C.A.C.3
  • 4
    • 0027525824 scopus 로고
    • Enhanced heat transfer, missing pin, and optimization for cylindrical pin fin arrays
    • Aug. 1993
    • Jubran, B.A., Hamdan, M.A., Abdualh, R.M., 1993, Enhanced Heat Transfer, Missing Pin, and Optimization for Cylindrical Pin Fin Arrays, ASME J. Heat Transfer, Vol. 115, Aug. 1993, pp. 576-583.
    • (1993) ASME J. Heat Transfer , vol.115 , pp. 576-583
    • Jubran, B.A.1    Hamdan, M.A.2    Abdualh, R.M.3
  • 5
    • 0002944616 scopus 로고
    • Effect of pin fin heat sink size on thermal performance of surface mount plastic quad flat packs
    • Atlanta, GA, Sept. 25-28
    • Shaukatullah, H., Gaynes, M.A., 1994, Effect of Pin Fin Heat Sink Size on Thermal Performance of Surface Mount Plastic Quad Flat Packs, Proc. 1994 Int. Electronics Packaging Conference, Atlanta, GA, Sept. 25-28, pp. 232-241.
    • (1994) Proc. 1994 Int. Electronics Packaging Conference , pp. 232-241
    • Shaukatullah, H.1    Gaynes, M.A.2
  • 6
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    • Experimental investigation in heat transfer of triangular and pin fin arrays
    • Springer Verlag
    • Al-Jamal, K., Khashashneh, H., 1998, Experimental investigation in heat transfer of triangular and pin fin arrays, Heat and Mass Transfer 34, pp. 159-162, Springer Verlag.
    • (1998) Heat and Mass Transfer , vol.34 , pp. 159-162
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  • 8
    • 0035363022 scopus 로고    scopus 로고
    • Modeling of the thermal and hydraulic behavior of plate fin, strip fin, and pin fin heat sinks under bypass flow conditions
    • June 2001, ISSN 1070-9886
    • Jonsson, H., Moshfegh, B., 2001, Modeling of the Thermal and Hydraulic Behavior of Plate Fin, Strip Fin, and Pin Fin Heat Sinks Under Bypass Flow Conditions, IEEE Trans. on Components and Packaging Technologies, Vol. 24, No. 2, June 2001, pp. 142-149, ISSN 1070-9886.
    • (2001) IEEE Trans. on Components and Packaging Technologies , vol.24 , Issue.2 , pp. 142-149
    • Jonsson, H.1    Moshfegh, B.2
  • 9
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    • Numerical simulation for thermal resistance of finned LSI packages
    • ASME
    • Yokono, Y., Hisano, K., 1993, Numerical Simulation for Thermal Resistance of Finned LSI Packages, Advances in Electronic Packaging, EEP-Vol. 4-2, ASME.
    • (1993) Advances in Electronic Packaging , vol.EEP-4 , Issue.2
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  • 11
    • 0012098930 scopus 로고
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  • 13
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  • 15
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  • 18
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.