Production proven temporary bonding and de-bonding equipment and technology

Proceedings - Electrochemical Society

Volumn PV 2005-12, Issue , 2005, Pages 233-243

  Kirchberger, H ^a   Pargfrieder, S ^a   Kettner, P ^a   Schaefer, C ^a  

^a EV GROUP   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; OPTOELECTRONIC DEVICES; SEMICONDUCTOR MATERIALS; SUBSTRATES; THIN FILMS;

CASSETTE-TO-CASSETTE MANNER; DICING FILMS; OPTOELECTRONICS INDUSTRY; RIGID CARRIER SUBSTRATES;

BONDING;

EID: 33645696859     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (1)

1. P.J. Taylor, W.A. Jesser, J.D. Benson, M. Martinka,J.H. Dinan, J. Bradshaw, M. Lara-Taysing, R.P. Leavitt, G. Simonis, W. Chang, W.W. Clarck III and K.A. Bertness,J. of Appl. Phys. 89, pp. 4365-4375, 2001.