High-Angle Electron Microscopy Technique for Analysis of Thin Film Contamination on IC Package Exteriors

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn 2003-November, Issue , 2003, Pages 62-67

  Barbieri, Thomas ^a,b   Schaper, Jake ^a,b   Dimuzio, Pete ^a,c  

^a MOTOROLA INC   (United States)

^b Arizona Product Development and Analysis Laboratory   (United States)

^c Radio Products Division   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE ANALYSIS; INTEGRATED CIRCUITS; TIMING CIRCUITS;

CONTINUOUS FILMS; ELECTRON-BEAM; IC PACKAGE; LOW ACCELERATING VOLTAGE; MICROSCOPY TECHNIQUE; MOTOROLA; SIMPLE++; THIN-FILMS; TILT ANGLE; YIELD LOSS;

THIN FILMS;

EID: 33645657679     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.31399/asm.cp.istfa2003p0062     Document Type: Conference Paper

References (5)

1. L. C. Feldman and J. W. Mayer, Fundamentals of Surface and Thin film Analysis, P T R Prentice Hall (1986)
2. P. Hovington, M. Lagace, D. Drouin, and R. Gauvin, Electron Range at Low Energy (Eo<10 KEV): Atomic Number Dependant?, Microsc. Microanal., 8 (Suppl. 2), 704CD-705CD (2002)
3. E. Boyes, Pros and Cons of Low Voltage SEM EDX Elemental Analysis, Microscopy Today, v11 #1, 5-10 (2003)
4. M. T. Postek, K. S. Howard, A. H. Johnson, and K. L. McMichael, Scanning Electron Microscopy: A Student's Handbook, Ladd Research Industries (1980)
5. Electron Flight Simulator, manufactured by Small World and distributed by SPI Supplies, ver3.1 (1987)