Technology and performance of millimetre-wave multilayer components

Journal of Materials Science: Materials in Electronics

Volumn 17, Issue 2, 2006, Pages 127-131

  Jakubowska, Małgorzata ^a   Tian, Zhengrong ^b   Free, Charles ^c   Pitt, Keith ^d  

^a ukasiewicz Research Network Institute of Microelectronics and Photonics   (Poland)

^b NATIONAL PHYSICAL LABORATORY   (United Kingdom)

^c UNIVERSITY OF SURREY   (United Kingdom)

^d MIDDLESEX UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC CONDUCTORS; MICROWAVE CIRCUITS; MULTILAYERS; PERFORMANCE; THICK FILMS;

BROADSIDE COUPLING; MILLIMETER-WAVE MULTILAYER COMPONENTS; THICK FILM PRINTING;

MILLIMETER WAVE DEVICES;

EID: 33645644722     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-5625-1     Document Type: Article

References (5)

1. A. Hobby, Chapter in "Handbook of Thick Film Technology", 2nd Edition, edited by K. Pitt, (Electrochemical Publications, Port Erin, Isle of Man, 2005).
2. T. Edwards, "Foundations of Interconnect and Microstrip Circuit Design", 3rd Edition, (John Wiley and Sons, 2000).
3. C. Free, P. Barnwell, C. Aitchison, I. Robertson, in Proceedings of the International Symposium on Microelectronics, Chicago, USA, Oct (1999) pp. 84-88
4. K. Pitt, M. Jakubowska, C. Free, Z. Tian, J. Mater. Sci Mater. Electron 16, 309-313 (2005)
5. Z. Tian, K. Pitt. Unpublished work, Middlesex University (2001).