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Volumn 3906, Issue , 1999, Pages 84-88
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Microwave properties of an integrated thick film and tape technology to 40 GHz
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Author keywords
[No Author keywords available]
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Indexed keywords
ELECTRIC PROPERTIES;
ELECTRIC VARIABLES MEASUREMENT;
ELECTROMAGNETIC DISPERSION;
ELECTROMAGNETIC WAVE ATTENUATION;
MICROWAVE CIRCUITS;
PERMITTIVITY;
SEMICONDUCTOR DEVICE MANUFACTURE;
SEMICONDUCTOR DEVICE STRUCTURES;
SURFACE ROUGHNESS;
WIRELESS TELECOMMUNICATION SYSTEMS;
LOW TEMPERATURE COFIRED CERAMICS;
MICROWAVE PROPERTIES;
THICK FILM CIRCUITS;
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EID: 0033348347
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (3)
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References (2)
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