Comparative study of Ni-P-diamond and Ni-P-CNT nanocomposite films

Journal of the Electrochemical Society

Volumn 153, Issue 1, 2006, Pages

  Chao, Tzu Yuan ^a   Shen, Guang Ren ^a   Cheng, Y T ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBES; CRACKS; ELASTIC MODULI; ELECTROPLATING; HARDNESS; NANOSTRUCTURED MATERIALS; SEMICONDUCTOR MATERIALS; SYNTHESIS (CHEMICAL);

NANODIAMOND POWDERS; NI-P-CNT NANOCOMPOSITE FILMS; NI-P-DIAMOND; SEMICONDUCTOR MANUFACTURING PROCESSES;

DIAMONDS;

EID: 33645526999     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2133324     Document Type: Article

References (19)

1. K. S. Teh, Y. T. Cheng, and C. Sambucetti, in IEEE Micro Electro Mechanical Systems Conference, Las Vegas, NV, p. 384 (2002).
2. G. R. Shen, L. N. Tsai, Y. T. Cheng, W. Hsu, and T. K. Lin, IEEE Conference on Nanotechnology, München, Germany, p. 192, (2004).
3. Sheng Hung Chemical Engineering Co., Ltd., http://www.shccl.com.tw
4. Seedchem Company PTY, Ltd., Camberwell 3124 Vic Melbourne, Australia.
5. W. Zhao, C. Song, and P. E. Pehrsson, J. Am. Chem. Soc., 124, 12418 (2002).
6. K. Lu and M. L. Sui, Acta Metall. Mater., 43, 3325 (1995).
7. L. Riester, P. J. Blau, E. Lara-Curzio, and K. Breder, Thin Solid Films, 377, 635 (2000).
8. W. X. Chen, J. P. Tu, L. Y. Wang, H. Y. Gan, Z. D. Xu, and X. B. Zhang, Carbon, 41, 215 (2003).
9. Y. L. Shi, Z. Yang, H. Xu, M. K. Li, and H. L. Li, J. Mater. Sci., 39, 5809 (2004).
10. J. N. Balaraju, T. S. N. Sankara Narayanan, and S. K. Seshadri, J. Appl. Electrochem., 33, 807 (2003).
11. Z. H. Xu and D. Rowcliffe, Surf. Coat. Technol., 161, 44 (2002).
12. G. E. Fougere, L. Riester, M. Ferber, J. R. Weertman, and R. W. Siegel, Mater. Sci. Eng., A, 204, 1 (1995).
13. H. C. Tasi and W. Fang, Sens. Actuators, A, 103, 377 (2003).
14. S. Timoshenko, D. H. Young, and W. Weaver, Jr., Vibration Problems in Engineering, 4th ed, John Wiley & Sons, New York (1974).
15. W. D. Callister, Jr., Materials Science and Engineering, 3rd ed., p. 516, John Wiley & Sons, New York (1994).
16. G. E. Dieter, Mechanical Metallurgy, 3rd ed., Chap. 6, pp. 184-240, McGraw-Hill Book Company, New York (1978).
17. H. C. Tsai, J. M. L. Tsai, H.-C. Chang, and W. Fang, in The 12th International Conference on Solid State Sensors, Actuators and Microsystems, Transducers'03, Boston, MA, p. 482 (2003).
18. D. G. Han and G. M. Choi, Solid State Ionics, 106, 71 (1998).
19. L. N. Tsai, G. R. Shen, Y. T. Cheng, and W. Hsu, in IEEE ECTC, Las Vegas, NV, p. 472 (2004).