Correlation between viscoelastic behavior and cooling stresses in a cured epoxy resin system

Journal of Applied Polymer Science

Volumn 99, Issue 3, 2006, Pages 679-690

  Nassiet, V ^a   Habas, J P ^b   Hassoune Rhabbour, B ^a   Baziard, Y ^a   Petit, J A ^a  

^a UNIVERSITÉ DE TOULOUSE   (France)

^b UNIVERSITÉ DE PAU ET DES PAYS DE L'ADOUR   (France)

Author keywords

Differential scanning calorimetry (DSC); Relaxation; Viscoelastic properties

Indexed keywords

COOLING SYSTEMS; CORRELATION THEORY; DIFFERENTIAL SCANNING CALORIMETRY; STOICHIOMETRY; VISCOELASTICITY;

RELAXATION; THERMOELASTIC MODEL; VISCOELASTIC PROPERTIES;

EPOXY RESINS;

COOLING; EPOXY RESIN; RHEOLOGY; STRESS; VISCOELASTICITY;

EID: 33645144917     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.22540     Document Type: Article

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