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Volumn 32, Issue 7, 1999, Pages 2387-2390
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Effects of prior cooling rates on Tg and sub-Tg heat flow transitions of cured epoxy resin
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Author keywords
[No Author keywords available]
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Indexed keywords
AGING OF MATERIALS;
ANNEALING;
COOLING;
CROSSLINKING;
CURING;
GLASS TRANSITION;
HEAT TRANSFER;
MOLECULAR DYNAMICS;
MOLECULAR STRUCTURE;
NITROGEN COMPOUNDS;
RESIDUAL STRESSES;
STRESS RELAXATION;
DIAMINODIPHENYL METHANE;
EPOXY RESINS;
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EID: 0033528608
PISSN: 00249297
EISSN: None
Source Type: Journal
DOI: 10.1021/ma9806965 Document Type: Article |
Times cited : (6)
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References (16)
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