Modeling of thermal stresses in joining two layers with multi- and graded interlayers

Journal of the American Ceramic Society

Volumn 89, Issue 1, 2006, Pages 251-257

  Hsueh, C H ^a,d   De Jonghe, L C ^b,d   Lee, C S ^c  

^a OAK RIDGE NATIONAL LABORATORY   (United States)

^b LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^c LG Electronics Inc   (South Korea)

^d AMERICAN CERAMIC SOCIETY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELASTIC THERMAL STRESSES; LAYERED STRUCTURES; MULTILAYER SYSTEMS;

ALUMINA; ELASTICITY; FINITE ELEMENT METHOD; MULTILAYERS; RESIDUAL STRESSES; SILICON NITRIDE; STIFFNESS; THERMAL EXPANSION;

THERMAL STRESS;

EID: 33645116177     PISSN: 00027820     EISSN: 15512916     Source Type: Journal    
DOI: 10.1111/j.1551-2916.2005.00658.x     Document Type: Conference Paper

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