Thermophysical and mechanical properties of a three-dimensional Hi-Nicalon/SiC composite

International Journal of Applied Ceramic Technology

Volumn 3, Issue 1, 2006, Pages 75-79

  Wu, Shoujun ^a   Cheng, Laifei ^a   Zhang, Qing ^a   Zhang, Litong ^a   Xu, Yongdong ^a  

^a NORTHWESTERN POLYTECHNICAL UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING STRENGTH; CHEMICAL VAPOR DEPOSITION; COMPOSITE MATERIALS; FRACTURE TOUGHNESS; MECHANICAL PROPERTIES; THERMAL DIFFUSION; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES;

FLEXURAL MODULUS; LOGARITHMIC FUNCTION; THERMAL DIFFUSIVITY; THERMAL EXPANSION COEFFICIENT;

SILICON CARBIDE;

EID: 33644971647     PISSN: 1546542X     EISSN: 17447402     Source Type: Journal    
DOI: 10.1111/j.1744-7402.2006.02056.x     Document Type: Article

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