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Volumn 26, Issue 1, 2006, Pages 7-11

Investigation on the monocrystalline silicon surface damage caused by slurry erosion

Author keywords

Erosive wear; Monocrystalline silicon; Nanoparticle impact; Surface damage

Indexed keywords

ATOMIC FORCE MICROSCOPY; CRYSTAL DEFECTS; EROSION; MICROSTRUCTURE; SILICON; SINGLE CRYSTALS; TRANSMISSION ELECTRON MICROSCOPY;

EID: 33644945400     PISSN: 10040595     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (5)

References (10)
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    • Xu, J.1    Luo, J.B.2    Lu, X.C.3
  • 2
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    • Chinese source
  • 3
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    • Moon, Y.1
  • 4
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    • Mechanical interactions at the interface of chemical mechanical polishing
    • Georgia: Georgia Institute of Technology
    • Lei S. Mechanical interactions at the interface of chemical mechanical polishing[D]. Georgia: Georgia Institute of Technology, 2000.
    • (2000)
    • Lei, S.1
  • 5
    • 0035338991 scopus 로고    scopus 로고
    • Material removal mechanism in chemical mechanical polishing: Theory and modeling
    • Luo J F, Dornfeld D A. Material removal mechanism in chemical mechanical polishing: theory and modeling[J]. IEEE Transaction on Semiconductor Manufacturing, 2001, 14(2): 112-133.
    • (2001) IEEE Transaction on Semiconductor Manufacturing , vol.14 , Issue.2 , pp. 112-133
    • Luo, J.F.1    Dornfeld, D.A.2
  • 6
    • 0003152418 scopus 로고    scopus 로고
    • A model for mechanical wear and abrasive particle adhesion during the chemical mechanical polishing process
    • Ahmadi G, Xia X. A model for mechanical wear and abrasive particle adhesion during the chemical mechanical polishing process[J]. Journal of the Electrochemical Society, 2001, 148(3): G99-G109.
    • (2001) Journal of the Electrochemical Society , vol.148 , Issue.3
    • Ahmadi, G.1    Xia, X.2
  • 7
    • 0031277984 scopus 로고    scopus 로고
    • Wear phenomena in chemical mechanical polishing
    • Liang H, Kaufman, Sevilla R, et al, Wear phenomena in chemical mechanical polishing[J]. Wear, 1997, 211: 271-279.
    • (1997) Wear , vol.211 , pp. 271-279
    • Liang, H.1    Kaufman2    Sevilla, R.3
  • 8
    • 0032187180 scopus 로고    scopus 로고
    • The role of particles adhesion and surface deformation in chemical mechanical polishing processes
    • Zhang F, Ahmed B. The role of particles adhesion and surface deformation in chemical mechanical polishing processes[J]. Electrochemical and Solid-State Letters, 1998, 1(4): 184-187.
    • (1998) Electrochemical and Solid-State Letters , vol.1 , Issue.4 , pp. 184-187
    • Zhang, F.1    Ahmed, B.2
  • 9
    • 0033324426 scopus 로고    scopus 로고
    • On the mechanics and physics in the nano-indentation of silicon monocrystals
    • Zhang L C, Tanaka H. On the mechanics and physics in the nano-indentation of silicon monocrystals[J]. JSME International Journal (Series A), 1999, 42: 546-559.
    • (1999) JSME International Journal (Series A) , vol.42 , pp. 546-559
    • Zhang, L.C.1    Tanaka, H.2
  • 10
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    • London: Cambridge University Press
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.